Brand development period of domestic mounter (2008～2014)

The development history of domestic placement machines:

After the introduction of LED SMD lighting and light source products in 2008, a simple single LED SMD product does not require too high production accuracy. Domestic companies see the opportunity to invest funds to develop a simple double-headed LED SMT machine.

This is the first model of the first-generation placement machine. This type of machine does not have visual identification devices, usually does not have a precise servo system, does not have automatic plate feeding and automatic nozzle change functions, and only has a low-precision stepping multi-axis system. After a year or two of development, the first-generation model has a visual centering function, and small and medium-sized LED companies are one of the entry-level models.

 In 2010, with the development of LED products mature, intelligent LED and drive power supply placement, the simple first model can no longer meet the requirements of multiple devices and precision, the second generation placement machine has visual recognition function, placement There are also 2 heads to expand to a larger number. The automatic transmission and automatic nozzle change function and the imported servo technology XY axis system can also be imported into the second-generation placement machine. The simple IC recognition function can also meet the needs of LED power supplies and LED lighting products. At the same time, it also extends to small household appliances and simple control panels.

(Second-generation domestic placement machine-LED and power supply placement machine)

 In 2013, the competition of LED placement machines became more fierce. From the 30,000-200,000 LED placement machine market, it has become a day-to-day era. Through 5 years of technology accumulation, domestic placement machine manufacturers have begun to cooperate with domestic universities to develop and import stickers. The chip machine agent maintains high-level cooperation. Through the learning and reference of mainstream imported chip placement machine technology, the third-generation chip placement machine has higher-level upgrades, such as device identification and placement optimization functions, and the Z-axis height is the first to adopt precision The servo technology meets the requirements for thickness detection and replenishment of different devices and ICs, and actual high-precision placement. The third-generation placement machine has more obvious improvements in speed and accuracy, and is suitable for high-speed and high-precision placement of components. The device of the device. The third-generation placement machine is actually a sophisticated industrial robot, a synthesis of machine-electricity-optical and computer control technology. Through functions such as absorption-displacement-positioning-placement, without damaging the components and the printed circuit board, it can quickly and accurately mount the SMC/SMD components to the specified pad positions on the PCB board. There are three methods for component alignment: mechanical alignment, laser alignment, and visual alignment. The placement machine is composed of a frame, xyz motion mechanism (ball screw, linear guide, drive motor), placement head, component feeder, PCB bearing mechanism, device alignment detection device, and computer control system. The movement is mainly realized by the xy movement mechanism. The power is transmitted by the ball screw and the directional movement is realized by the rolling linear guide. Such a transmission form not only has small movement resistance, compact structure, and high movement accuracy. The placement accuracy of each component has been improved.

The placement machine is marked with Mark on important components such as the placement spindle, dynamic/static lens, nozzle holder, and feeder. Machine vision can automatically calculate these Mark center system coordinates, establish the conversion relationship between the placement machine system coordinate system and the PCB and placement component coordinate system, and calculate the precise coordinates of the placement machine movement; the placement head is based on the imported The package type, component number and other parameters of the component are placed in the corresponding position to grab the nozzle and suck the component; the static lens detects, recognizes and aligns the suction component according to the visual processing program; after the alignment is completed, the placement head will paste the component Install it to the predetermined position on the PCB. This series of component recognition, centering, inspection and placement actions are all instructed and automatically completed by the control system after the industrial computer obtains the relevant data according to the corresponding instructions.

Modern equipment and control concept, compact structure design, to ensure high efficiency and high precision single or double product processing requirements.　　

 For electronic components, PCB and integrated circuit manufacturing equipment, after more than 20 years of development, especially the rapid development after 2003, the front-end industrial equipment supporting SMT, including printed circuit boards, passive components and other electronic parts manufacturing The equipment has basically realized localization, and many well-known private enterprises have been formed, and a batch of outstanding scientific research results with high technology content, large market capacity, and good application and industrialization prospects have been accumulated.