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SMT production process

SMT production process1

1. single side assembly:

Incoming inspection => silk-screen solder paste (spot patch adhesive) => patch => drying (curing) => reflow welding => cleaning => inspection => repair

 

2. Double-sided assembly:

A: incoming inspection => PCB side A silk screen soldering paste (spot adhesive) => patch => drying (curing) => side A reflow soldering => cleaning => turning board => PCB side B silk screen soldering paste (spot adhesive) => patch => drying => reflow soldering (it is best to only clean side B = >0 cleaning = >1 detecting = >2 repair)

This process is suitable for large SMD such as PLCC on both sides of PCB.

B: incoming inspection => PCB A side silk screen solder paste (spot adhesive) => patch => drying (curing) =>A side reflow soldering => cleaning => turning board => PCB B side spot adhesive patch => patch => curing => bb side wave soldering = >0 cleaning = >1 detection = >2 repair)

This process is suitable for reflow soldering on A side and wave soldering on B side of PCB. This process should be used when only SOT or SOIC (28) pin is below in SMD assembled on side B of PCB.

 

3. Single-side mixed assembly process:

Incoming inspection => PCB side A screen printing solder paste (spot adhesive) => patch => drying (curing) => reflow welding => cleaning => plug-in => wave soldering => cleaning => testing => repair

 

4. Double-sided mixed assembly process:

A: incoming inspection => PCB surface patch adhesive => patch => curing => turning board => PCB surface A plug-in => wave soldering => cleaning => inspection => repair

It is suitable for SMD components more than separate components.

B: incoming inspection => PCB surface A plug-in (pin bending) => flip board => PCB surface B patch adhesive => flip board => curing => flip board => wave soldering => cleaning => check => repair

It is suitable for separating components more than SMD components.

C: incoming inspection => PCB side A silk screen solder paste => patch => drying => backflow welding => plug-in, pin bending => flaps => PCB side B patch adhesive => patch => curing => flaps = >0 washing = >1 detection = >3 repair side A mixed, side B paste.

D: incoming inspection =>PCB surface B patch adhesive => patch => curing => turning board =>PCB surface A screen printing solder paste => patch => backflow soldering => plug-in => surface B wave soldering => cleaning = >0 inspection = >1 repair side A mix, side B paste. SMD on both sides first, reflow welding, later instrumentation, wave soldering

E: incoming material = > the B side of PCB solder paste printing and patch glue (point) = > patch = > drying (curing) = > reflow soldering = > = > PCB turning A surface screen printing solder paste = > strips drying = = > reflow soldering (can use local welding) 1 = > plugins = > wave soldering 2 (if less instrumentation components, can use manual welding) = = > > cleaning testing, surface mount B = > repair surface assortments.

 

5. double-sided assembly process

A: incoming material inspection,PCB side A silk-screen solder paste (spot patch adhesive), patch, drying (curing), side A reflow welding, cleaning, turning; PCB b-side silk screen solder paste (spot-on adhesive), patching, drying, reflow soldering (preferably only for b-side, cleaning, testing and repair)

This process is suitable for large SMD such as PLCC on both sides of PCB.

B: incoming material inspection,PCB side A silk-screen solder paste (spot patch adhesive), patch, drying (curing), side A reflow welding, cleaning, turning; This process is suitable for reflow soldering on A side of PCB and wave soldering on B side. This process should be used when only SOT or SOIC (28) pin is below in SMD assembled on side B of PCB.


Post time: Oct-02-2020